INEGI joins Bosch to better predict behavior of adhesive joints in demanding environments

A group of INEGI researchers created, together with the german multinational Bosch, a set of procedures to allow the industry to use adhesives as a bonding method with more reliability.

Adhesive joints are increasingly used by the electronic components industry in multi-material components or components that require high quality connections, with great resistance and durability. However, there are still barriers that limit its use.

As Catarina Borges, responsible for the project at INEGI, explains, "the presence of contaminating agents or humidity alters the mechanical properties of the adhesive joint, weakens the bond, and can also result in areas of poor adhesion between the adhesive and the substrate.”.

To better understand these issues, the team sought to study the effect that humid environments have on the bond, particularly when subjected to high temperatures, as well as to assess changes in adhesive strength when subjected to these conditions. In parallel, they studied the effect of contamination from detergents used in surface preparation, namely in metalworking production processes that involve the use of fluids to cool or lubricate the process.

Based on this work and the data collected, they created a method to evaluate different combinations of adhesives and substrates and determine if they have sufficient strength and fracture toughness for a given application.

These tools were designed for industrial application, allowing an agile and quick assessment to determine whether a joint performs satisfactorily when exposed to demanding conditions.