Measuring cracks and fissures is easier thanks to new equipment developed at INEGI

Detecting and measuring cracks and fissures, even before they reach proportions visible to the naked eye, is essential to assess the state of conservation of various types of structures. Image processing-based methods are the most used tools, but the approach still raises some problems.

To improve this context, a team of INEGI researchers is creating a new approach to increase the spatial resolution of measurements at the crack front. This means that the captured images will be more «sharp» and the ability to measure the cracks will be enhanced.

The team is combining digital image correlation (CDI) techniques and the sherography interferometric technique, which will result in a new approach to measuring strain fields in cracks. A portable test equipment was also developed, in order to respond to the experimental needs of the type of specimen and standard under study.

Pedro Moreira, researcher responsible for the project at INEGI, explains that, for this purpose, "we defined and prepared experimental procedures based on specific test standards, and developed numerical simulations, based on the finite element method, to determine the voltage intensity factor ( SIF) for different slot lengths”.

The project "MIAMI - Multiscale Monitoring of Cracks" also has the IST - Instituto Superior Técnico of the University of Lisbon, and is co-financed by the European Union through the European Regional Development Fund, within the framework of COMPETE 2020, and by the FCT - Foundation for Science and technology.