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INEGI and Bosch together in innovation project in the area of adhesives for electronic equipment

07 October 2020
Adhesive joints are being used increasingly in the electronic components industry, with benefits in terms of composite materials and durability of connections. It’s therefore essential to make this technology more reliable and to map its behavior in this context.

That is precisely the objective of the project that brings together INEGI and the multinational Bosch, which aims to answer and anticipate the challenges of this industry.

As Lucas da Silva, responsible for the project at INEGI, explains "the electronic circuit boards are essential elements for the operation of any electronic equipment, and their coating is intended to be durable and resistant in order to protect the components inside".

In this context, adhesives play an essential role, as they fulfill the function of ensuring the insulation of the wrapping coating. "The exposure of the boards to external factors generates corrosion in the circuits, decreasing their useful life", adds Catarina Borges, researcher of the project.

Simplifying the prediction of adhesive joint failure is a priority

However, the adhesive joint itself, whose mission it is to protect electronic circuits, can also deteriorate with exposure to harsh environments, particularly when subjected to moisture and contaminants.

Contamination with water or other residues "alter the mechanical properties of the adhesive joint, weakens the bond, and results in detached areas between adhesive and adhesive. Effects that tend to result in the total rupture of the adhesive joint, often in an unpredictable way”, says Catatina Borges.

Understanding the mechanics of adhesive joints and predicting their behavior in these contexts is, however, of high importance for manufacturers. The more reliable and accurate the predictive techniques are, the easier it will be for manufacturers to design the ideal solution for a specific application.

To respond to this challenge, the team of specialists from INEGI, in partnership with the German Bosch, is developing a numerical method to simulate the effect of moisture and contamination on adhesive joints. The aim is to create "simple application processes in an industrial context, to determine whether a joint behaves satisfactorily when exposed to demanding conditions”.